Heat treating
Many material properties are achieved by states that arise on the way to equilibrium without corresponding to this final state. This is done by controlled heating and cooling with heat treatment. During heat treatment, only solid-state reactions take place, which are usually thermally activated (diffusion). The exception is martensitic transformation (diffusionless transformation by crystal shearing).
Heat treatment includes the following processes:
- Heating
- Holding at one temperature (homogenising)
- Cooling
The material to be treated passes through different temperatures at different times (temperature-time curve) and is then cooled at different rates in different media (water, oil, salt, inert gas, air) depending on the material and process. The range here extends from furnace cooling to abrupt quenching in order to adjust certain technological properties (chemical concentration, strength, hardness, toughness, microstructure, etc.).
Annealing of copper and times for heat treatments
It is difficult to give general times for heat treatments. Basically, there is a correlation between time and temperature, i.e. the same result can be achieved with a short time and high temperature (used in continuous furnaces) as with a long time and low temperature. The times also depend on:
- On the oven (temperature distribution, temperature uniformity);
- On the number of parts in the oven and the charging;
- On the size or mass of the individual parts.
As a rule of thumb for the standard processes (discontinuous in a pot, bonnet or chamber oven) can be applied:
- Small parts 30-60 min.
- Large parts 1-3 h.
All times apply from the time when the entire batch is heated through (!). Annealing should be carried out under protective gas (nitrogen is sufficient for copper materials) to avoid scaling. The cooling can be done as desired, with copper materials there are no hardening effects as with steel, not even with rapid cooling. Rapid cooling can possibly lead to distortion.
Reference values for the heat treatment of non-hardenable copper materials
(all values in °C)
Material | Stress relief annealing | Soft annealing | Homogenisation |
---|---|---|---|
Copper and silver alloyed copper | 100 - 150 | 400 - 500 | (not applicablet) |
Brass (CuZn) | 250 - 300 | 450 - 600 | (not applicable) |
Bronze (CuSn), wrought materials | 200 - 300 | 475 - 675 | ca. 700 |
Bronze, cast materials | 200 - 450 | (not used) | ca. 650 |
Nickel silver (CuNiZn) | 250 - 400 | 580 - 650 | (not applicable) |
CuAl alloys (Al-Bronze) * | 250 - 300 | ca. 600 | (not applicable) |
CuNi alloys | 280 - 500 | 620 - 900 | (not applicable) |
* In the case of heterogeneous alloys, additional targeted adjustment of strengths by heat treatments between 450-950 °C, see literature
Recommended times and temperatures for soft annealing of some selected copper-based materials
Abbreviation | Temperature [°C] | Time [h] |
---|---|---|
Cu-ETP / Cu-FRHC | 300 - 650 1) | 0,5 - 3 |
Cu-OF | 425 - 650 | 0,5 - 3 |
Cu-PHC / Cu-HCP | 350 - 650 | 0,5 - 3 |
Cu-DHP | 350 - 650 | 0,5 - 3 |
CuZn15 | 425 - 650 | 0,5 - 3 |
CuZn30 | 450 - 675 | 0,5 - 3 |
CuZn33 | 425 - 700 | 0,5 - 3 |
CuZn37 | 450 - 600 2) | 0,5 - 3 |
CuZn36Pb3 | 425 - 600 | 0,5 - 3 |
CuZn39Pb2 | 425 - 600 | 0,5 - 3 |
CuZn39Pb3 | 425 - 650 | 0,5 - 3 |
CuZn40Pb2 | 425 - 650 | 0,5 - 3 |
CuZn31Si1 | 500 - 600 | 0,5 - 3 |
CuZn38Mn1Al | 500 - 650 | 0,5 - 3 |
CuZn37Mn3Al2PbSi | 500 - 650 | 0,5 - 3 |
CuSn4 | 500 - 700 3) | 0,5 - 3 |
CuSn6 | 500 - 700 3) | 0,5 - 3 |
CuSn8 | 500 - 700 3) | 0,5 - 3 |
(CuSn6Zn6) | 500 - 700 3) | 0,5 - 3 |
CuNi18Zn20 | 600 - 750 4) | 0,5 - 3 |
CuNi18Zn27 | 600 - 750 4) | 0,5 - 3 |
CuNi9Sn2 | 600 - 700 | 0,5 - 3 |
CuNi10Fe1Mn | 625 - 750 | 0,5 - 3 |
(CuNi44Mn1) | 650 - 850 | 0,5 - 3 |
CuAg0,10 | 400 - 650 | 0,5 - 3 |
CuAg0,10P | 400 - 650 | 0,5 - 3 |
CuFe2P | 650 - 700 | 0,5 - 3 |
CuSP | 425 - 650 | 0,5 - 3 |
CuTeP | 425 - 650 | 0,5 - 3 |
CuZn0,5 | 425 - 600 | 0,5 - 3 |
CuBe2 | 720 -760 | 0,5 - 3 |
CuBe2Pb | 720 -760 | 0,5 - 3 |
CuCo2Be | 920 -960 | 0,5 - 3 |
CuNi2Si | 725 - 760 | 0,5 - 3 |
CuCr1Zr | 600 - 800 | 0,5 - 3 |
CuZr | 850 - 965 | 0,5 - 3 |
* 1) When annealing in a reducing atmosphere, keep the temperature below 450 °C to avoid hydrogen sickness.
2) It is important not to exceed the specified maximum temperature in order not to impair the cold formability of the material.
3) Alloys are susceptible to cracking during annealing and should be thermally stress relieved beforehand.
4) The alloys are to be annealed in an oxidising atmosphere. They are susceptible to cracking and should be thermally stress relieved beforehand.
( ) Alloys no longer included in EN
Recommended annealing times and temperatures for stress relief annealing of selected copper-based wrought materials
Abbreviation | Temperature [°C] | Time [h] |
---|---|---|
Cu-ETP / Cu-FRHC | 150 - 200 1) | 1 |
Cu-OF | 150 - 200 | 1 |
Cu-PHC / Cu-HCP | 150 - 200 | 1 |
Cu-DHP | 150 - 200 | 1 |
CuZn15 | 200 - 300 | 1 |
CuZn30 | 200 - 300 | 1 |
CuZn33 | 200 - 300 | 1 |
CuZn37 | 200 - 300 | 1 |
CuZn36Pb3 | 200 - 300 | 1 |
CuZn39Pb2 | 200 - 300 | 1 |
CuZn39Pb3 | 200 - 300 | 1 |
CuZn40Pb2 | 200 - 300 | 1 |
CuZn31Si1 | 250 - 350 | 1 |
CuZn38Mn1Al | 300 - 430 | 1 |
CuZn37Mn3Al2PbSi | 350 - 450 | 1 |
CuSn4 | 200 - 300 | 1 |
CuSn6 | 200 - 300 | 1 |
CuSn8 | 200 - 300 | 1 |
(CuSn6Zn6) | 200 - 300 | 1 |
CuNi18Zn20 | 300 - 400 | 1 |
CuNi18Zn27 | 300 - 400 | 1 |
CuNi9Sn2 | 250 - 400 | 1 |
CuNi10Fe1Mn | 280 -450 | 1 |
(CuNi44Mn1) | 300 - 400 | 1 |
CuAg0,10 | 250 - 300 1) | 1 |
CuAg0,10P | 250 - 300 | 1 |
CuFe2P | 200 - 300 | 1 |
CuSP | 150 - 200 | 1 |
CuTeP | 150 - 200 | 1 |
CuZn0,5 | 200 - 300 | 1 |
CuBe2 | 250 - 300 | 1 |
CuBe2Pb | 250 - 300 | 1 |
CuCo2Be | 350 - 420 | 1 |
CuNi2Si | 350 - 450 | 1 |
CuCr1Zr | 300 - 350 | 1 |
CuZr | 350 - 400 | 1 |
* 1) When annealing in a reducing atmosphere, keep the temperature below 450 °C to avoid hydrogen sickness.
( ) Alloys no longer included in EN
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